tesa_Electronics_Smartwatch-with-waterdrops

Structural Bonding Solutions

for increased device reliability

General features

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Best bonding
tesa-icon-chemical-resistance
Chemical resistance
tesa-icon-impact-resistance
Impact resistance
icon-temperature-humidity-resistance
Temperature and humidity resistance

Typical Applications of our Structural Bonding Solutions

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Component mounting
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Lens and back cover mounting
Druck
Soft goods and accessories
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FPC bonding

Assortment overview

tesa® HAFtesa® LTRtesa® LTCtesa® LTTtesa® UV epoxytesa® L-tape
ColorBlack, amberBlack, white, translucentBlackTranslucentWhiteTranslucent
AdhesiveNitrile rubber/phenolic resinCross-linkable polyurethaneCross-linkable polyurethaneThermoplastic polyurethaneUV curable reactive epoxyLight curable
Activation temperature [°C]>120>75>75>80Room temperatureRoom temperature
Special featuresTemperature resistance,chemical resistanceImpact resistance,wettability on fabricsImpact resistance,chemical resistanceHigh peel adhesion to fabricsActivation at room temperature, reworkabilityActivation at room temperature, impact resistance

Thicknesses

Thickness [μm]tesa® HAFtesa® LTRtesa® LTCtesa® LTTtesa® UV epoxytesa® L-tape
10 μm⚫ 58469
20 μm⚫ 58477
25 μm
30 μm⚫ 58471
Ⓐ 8471
⚪ 8711⦾ 8741
50 μm⚫ 58470⚫ 58480
⚪ 8710
⦾ 8722
⚫ 58722⦾ 87422
60 μmⒶ 8472
80 μm⚫ 58473
Ⓐ 8473
100 μm⚫ 58474
Ⓐ 8474
⚫ 58484
⚪ 8714
⚫ 58724⚪ 8684
125 μm⚫ 58475
Ⓐ 8475
150 μm⚫ 58476
Ⓐ 8476
⚫ 58486
200 μm⚫ 58478
Ⓐ 8478
⚫ 58488⦾ 8698
300 μm⚫ 58489

Product performance1

Reference product ⚫ 58474⚫ 58484⚫ 58724⦾ 87422⚪ 8684⦾ 8694
Reference substrateSUS/SUSPC/PCAL/ALPC/PCPC/PCAI/PC
Push-out [MPa]>5.5>5.5>4.0>2.5>2.5>3.0
DuPont [J; xy/z]>0.5>4.0>1.0n.a.>0.55>1.0
Reliability1⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫
Chemical resistance1⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫⚫

1 Assessment is done only in relation to other products of this assortment

2 Deviating thickness 

Ⓐ Amber ⦾ Translucent ⚪ White ⚫ Black 

Get in touch!

Our tape experts would be very happy to help you master your challenges.