Structural Bonding Solutions

tesa® structural bonding solutions provide high structural bonding performance to a wide variety of substrates. They withstand the harshest conditions by combining outstanding chemical and aging resistance. The processing of these adhesive systems is simplified due to excellent die cuttability, immediate handling stability after activation, and low oozing.

Heat-activated films

tesa® HAF is a thermosetting adhesive system. An irreversible cross-linking reaction is initiated by heat and pressure starting at temperatures above 120°C, resulting in extremely strong bonds.

Low-temperature activated film

Our low-temperature reactive films tesa® LTR and tesa® LTC have been designed for activation at moderate temperatures. The cross-linking starts at a bond-line temperature above 75°C. tesa® LTT is a low temperature thermoplastic film designed for soft goods assembly requiring low processing temperatures.

Light-curing tapes

tesa® UV epoxy and tesa® L-tape are our latest developments that will cure at room temperature when exposed to light. They achieve significantly higher bonding strengths compared to PSAs. They come with high initial tack and immediate holding strength after bonding.