휴대폰 - 방열 솔루션

The core of thermal management is the cooling system that works in the background while users raise the temperature in their smart companions. Due to the small volume of smartphones and tablets, however, active cooling technologies such as fans or electrothermal Peltier elements are not an option. Therefore, passive heat dissipation is the preferred physical principle in cooling systems. Different technologies are taken into consideration: Heat Sinks – these are heat conductors with a large surface, for example, made of aluminum; Heat Spreaders – such as thin sheet metal made of copper or aluminum; or Heat Pipes – closed, thin-walled pipes made of thermally highly conductive material, filled with vaporizable liquid, such as water. 

What every cooling system needs are "bridges" to remove the heat loss, so-called Thermal Interface Materials (TIMs). In addition to other materials, special adhesive tapes from tesa (so-called Thermal Management Tapes TMT) are also used for this purpose. The advantage: On the one hand, they ensure that the components inside smartphones are firmly held together. On the other hand, they close gaps and eliminate air pockets. This is important because air, being a poor heat conductor, increases the risk of heat build-up. 

With its various adhesive tape applications, tesa has been a popular supplier to the global electronics industry for many years – up to 70 tesa tapes may find space in a smartphone. The products suitable for heat dissipation are constantly being further developed. "We use double-sided adhesive tapes and enrich them with ceramic particles. And they are no thicker than an average human hair," explains Minyoung Bai. He works for tesa Electronics in South Korea and, as head of the laboratory for conductive tapes, is the company's expert.