tesamoll® Door-to-floor double-roll

You simply push it under the door leaf and it will securely stay in place to keep that valuable heat inside, while cold air and dust are effectively blocked. It is reusable for many years and will work with any smooth floor without a doorsill such as parquet or tiles and can cover gaps up to 22 mm.

• Suitable for smooth flooring surfaces like parquet, wooden or tile floors without a (or just with a very low) doorsill
• Suitable for interior use
• Suitable for gaps of up to 22mm
• Suitable for door leaf thicknesses up to 40 mm
• No adhesive