tesa HAF® 8412 ACF

50 µm amber anisotropic conductive structural bonding film


Product Features
  • Excellent grounding performance in applications with structural bonding requirements
  • High bonding strength in narrow and small bonding areas
  • Good ageing resistance
All product features
Product description

tesa HAF® 8412 is an amber heat-activated structural bonding film based on phenolic resin and nitrile rubber containing conductive particles.


Product details and specifications

Product Features

  • Excellent grounding performance in applications with structural bonding requirements
  • High bonding strength in narrow and small bonding areas
  • Good ageing resistance
  • Reliable SmartCard chip bonding and electrical connectivity in one step
  • Suitable for PVC, ABS and PC SmartCards (DI)

Application Fields

tesa HAF® 8412 is designed for the embedding of chip-modules into dual interface smart cards for contact less and contact based applications and demanding grounding applications in consumer electronics.
Technical Recommendations:
The following values are recommendation for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip-modules as well as customer requirements.
Embedding of chip-modules into dual interface smart cards
1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. The pre-lamination step does not effect the shelf life time of the adhesive tape. Pre-laminated module belts can be stored over the same period of time as the adhesive tape.
Machine setting:
Temperature: 130–150 °C,
Pressure: 2–3 bar,
Speed: 1.5–2.5 m/min
2. Module embedding
During module embedding, the pre-laminated modules are die-cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. Depending on the type of the implanting line, single step or multiple step process can be used. Today, most implanting machines have multiple heat press steps.
Single step process
Machine setting:
Temperature¹: 180–220 °C,
Pressure: 80–130 N/module,
Time: 1.5 s
3. Multiple step process (2 or more heating stamps)
Machine setting:
Temperature¹: 180-220 °C,
Pressure 80-130 N/module,
Time: 2 x 0.7 s / 3 x 0.5 s
¹Temperature recommendations refer to what can be measured inside the heating stamp. Different temperature settings are recommended for different card material:
  • PVC 180–190 °C
  • ABS 180–190 °C
  • PET 190–200 °C
  • PC 200–220 °C
Grounding applications in consumer electronics
1. Pre-lamination: During pre-lamination, the tape is laminated onto one component.
Machine setting:
Temperature¹: ≥120 °C,
Pressure²: ≥5 bar,
Time: ≥5 s
2. Bonding: Remove the liner from the tape after pre-lamination step. Place the pre-laminated component onto the substrate to bond with. Apply sufficient temperature while applying pressure for the bonding time to reach sufficient bonding strength.
Machine setting:
Temperature²: 120-250 °C,
Pressure³: 5-30 bar,
Time: 5 s – 3 min
² ‘Pre-lamination’ and ‘Bonding’ temperature refer to the data that is measured in the bond line. ³ ‘Pre-lamination’ and ‘Bonding’ pressure refer to the force that is transformed from jig surface directly to the bonding area. Bonding strength values were obtained under standard laboratory conditions. (Material: etched Al test specimen / bonding conditions: temperature = 180 °C; pressure = 10 bar; time = 7 sec). To reach maximum bonding strength surfaces should be clean and dry.
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.
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