Product Construction
| Adhesive Type | copolyamide |
| Backing material | none |
| Color | translucent |
| Liner Type | glassine |
tesa HAF® 8414 ACF
translucent z-axis conductive HAF tape
Product description
tesa HAF® 8414 is a translucent heat-activated adhesive film that contains electrically conductive particles.
Special Features:
1 Chip module bonding and electrical connectivity in one step
1 Good workability on all common implanting lines
1 Suitable for PVC, ABS and PC cards (Dual Interface (D.I.) and contactless cards)
1 Suitable for silver ink substrates and wire antenna
Mean particle diameter: 40 µm/1.6 mils
Product details and specifications
Application Fields
tesa HAF® 8414 is designed for all applications where reliable electrical connections and strong bonds are required. Lead applications are chip module embedding in Dual Interface (DI) cards and for RFID tags.
Product Construction
| Adhesive Type | copolyamide |
| Backing material | none |
| Color | translucent |
| Liner Type | glassine |
Additional Info
Technical Recommendations:
Please note that optimal parameters strongly depend on the type of machine, particular materials for card bodies, antenna material or chip-modules as well as individual customer requirements. The bonding time depends on the heat transition of the used substrates. Additionally we recommend a cooling step directly after the bonding step. Thereby pressure should be applied until film temperature decreases below softening temperature (aprrox. 110 °C/230 °F).
The following data are recommendations for the initial set-up of machine parameters.
1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. An accurate pre-lamination is in particular important for tesa HAF® 8414 in order to ensure a good adhesion and a good conductivity inside of the final product.
Machine setting:
2. Conductive Bonding:
During module embedding, the pre-laminated modules are die-cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. Depending on the type of the implanting line, single step or multiple step process can be used. Today, most implanting machines have multiple heat press steps.
Single step process - Machine setting:
¹Temperature recommendations refer to what can be measured inside the heating stamp. Different temperature settings are recommended for different card material:
PVC 180 – 190 ° C (356-374 °F)
ABS 180 – 190 ° C (356-374 °F)
PET 190 – 200 ° C (374-392 °F)
PC 200 – 220 °C (392-428 °F)
To reach maximum bonding strength surfaces should be clean and dry. Storage conditions according to tesa HAF® shelf life concept.
Please note that optimal parameters strongly depend on the type of machine, particular materials for card bodies, antenna material or chip-modules as well as individual customer requirements. The bonding time depends on the heat transition of the used substrates. Additionally we recommend a cooling step directly after the bonding step. Thereby pressure should be applied until film temperature decreases below softening temperature (aprrox. 110 °C/230 °F).
The following data are recommendations for the initial set-up of machine parameters.
1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. An accurate pre-lamination is in particular important for tesa HAF® 8414 in order to ensure a good adhesion and a good conductivity inside of the final product.
Machine setting:
- Temperature 130 - 150 °C (266-302 °F)
- Pressure 3 - 4 bar
- Time 2.5 m/min.
2. Conductive Bonding:
During module embedding, the pre-laminated modules are die-cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. Depending on the type of the implanting line, single step or multiple step process can be used. Today, most implanting machines have multiple heat press steps.
Single step process - Machine setting:
- Temperature¹ 160 – 220 °C (320-428 °F)
- Pressure 65 - 130 N/module
- Time 1.5 s
- Temperature¹ 180 – 220 °C (356-428 °F)
- Pressure 65 - 130N/module
- Time 2 x 0,7 s. / 3 x 0.5 s.
¹Temperature recommendations refer to what can be measured inside the heating stamp. Different temperature settings are recommended for different card material:
PVC 180 – 190 ° C (356-374 °F)
ABS 180 – 190 ° C (356-374 °F)
PET 190 – 200 ° C (374-392 °F)
PC 200 – 220 °C (392-428 °F)
To reach maximum bonding strength surfaces should be clean and dry. Storage conditions according to tesa HAF® shelf life concept.
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.
Downloads
Download the files below for more technical details and information on this product.
![[en-en] tesa_HAF-amber_dr_001](/en-us/files/images/202402/0/medium-11173882,11173882_padded1x1_18.webp "tesa_HAF-amber_dr_001")
