Structural Bonding Solutions

Electronic devices are increasingly miniaturized and sophisticated. Complex designs require smaller bonding areas and higher tape performance. tesa® structural bonding solutions meet the most challenging demands of manufacturers and consumers over the life cycle of the devices. They provide high structural bonding performance to a wide variety of substrates with both fast and durable bonds. They withstand the harshest conditions by combining outstanding chemical and aging resistance with excellent sealing properties. The processing of these adhesive systems is simplified due to excellent die-cuttability, immediate handling stability after heat activation, and low oozing.

Our tesa HAF® and tesa® XPU series are thermosetting adhesive systems. An irreversible cross-linking reaction is initiated by heat and pressure starting at temperatures above 110°C.