tesa HAF® 8410

Technical Recommendations for smart card applications:
The following values are recommendations for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip-modules as well as customer requirements.
1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. The pre-lamination step does not effect the shelf life time of the adhesive tape. Pre-laminated module belts can be stored over the same period of time as the adhesive tape.
Machine setting:

• Temperature 120 – 140 °C
• Pressure 2 – 3 bar
• Time 1.5 – 2.5 m/min.

2. Module Embedding:
During module embedding, the pre-laminated modules are die cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. Depending on the type of implanting line, single step or multiple step process can be used. Today, most implanting machines have multiple heat press steps.
Single step process - Machine setting:

• Temperature¹ 180 – 220 °C
• Pressure 65 N/module
• Time 1.5 s.

Multiple step process (2 or more heating stamps) - Machine setting:

• Temperature¹ 180 – 220 °C
• Pressure 65 N/module
• Time 2 x 0,7 s. / 3 x 0.5 s

¹ Temperature as measured inside the heating stamp. Different temperature settings are recommended for different card material:
PVC 180 – 190 ° C
ABS 180 – 190 ° C
PET 190 – 200 ° C
PC 200 – 220 °C

Bonding strength values were obtained under standard laboratory conditions. Value is guaranteed clearance limit checked with each production batch (Material: Etched aluminium test specimen / Bonding conditions: Temp. = 120 °C; p = 10 bar; t = 8 min)

To reach maximum bonding strength surfaces should be clean and dry. Storage conditions according to tesa® HAF shelf life concept.