Product Construction
| Backing material | none |
| Color | amber |
| Total thickness | 50 µm |
| Type of adhesive | nitrile rubber / phenolic resin |
| Type of liner | glassine |
tesa HAF® 8412 ACF
45µm amber anisotropic conductive HAF tape
Product description
tesa® HAF 8412 is an amber heat activated adhesive film based on reactive phenolic resin and nitrile rubber containing conductive particles.
Special features:
1 Reliable chip bonding and electrical connectivity in one step
1 Good workability on all common implanting lines
1 Suitable for PVC, ABS and PC cards (DI)
1 Good ageing resistance
Thickness: 45 µm (mean value of particle size)
Product details and specifications
Application Fields
tesa® HAF 8412 is designed for the embedding of chip-modules into dual interface smart cards for contact less and contact based applications.
Product Construction
| Backing material | none |
| Color | amber |
| Total thickness | 50 µm |
| Type of adhesive | nitrile rubber / phenolic resin |
| Type of liner | glassine |
Properties / Performance Values
| Activation temperature | 120 °C |
| Contact resistance z-direction | 200 mOhm |
| Bonding strength | 4 N/mm² |
Properties / Performance Values
| Activation temperature | 120 °C |
| Contact resistance z-direction | 200 mOhm |
| Bonding strength | 4 N/mm² |
Additional Info
Technical Recommendations:
The following values are recommendation for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip-modules as well as customer requirements.
1.Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. The pre-lamination
step does not effect the shelf life time of the adhesive tape. Pre-laminated module belts can be stored over the same period of time as the adhesive tape.
Machine setting:
1 Temperature 130 – 150 °C
1 Pressure 2 – 3 bar
1 Speed 1.5 – 2.5 m/min
2. Module Embedding:
During module embedding, the pre-laminated modules are die-cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. Depending on the type of the implanting line, single step or multiple step process can be used. Today, most implanting machines have multiple heat press steps.
Single step process – Machine setting:
1 Temperature¹ 180 – 220 °C
1 Pressure 80 – 130 N/module
1 Time 1.5 s
Multiple step process (2 or more heating stamps) – Machine setting:
1 Temperature¹ 180 - 220 °C
1 Pressure 80 - 130 N/module
1 Time 2 x 0.7 s / 3 x 0.5 s
¹Temperature recommendations refer to what can be measured inside the heating stamp. Different temperature settings are recommended for different card material:
PVC 180 – 190 °C
ABS 180 – 190 °C
PET 190 – 200 °C
PC 200 – 220 °C
To reach maximum bonding strength surfaces should be clean and dry. Storage conditions according to tesa® HAF shelf life concept
The following values are recommendation for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip-modules as well as customer requirements.
1.Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. The pre-lamination
step does not effect the shelf life time of the adhesive tape. Pre-laminated module belts can be stored over the same period of time as the adhesive tape.
Machine setting:
1 Temperature 130 – 150 °C
1 Pressure 2 – 3 bar
1 Speed 1.5 – 2.5 m/min
2. Module Embedding:
During module embedding, the pre-laminated modules are die-cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. Depending on the type of the implanting line, single step or multiple step process can be used. Today, most implanting machines have multiple heat press steps.
Single step process – Machine setting:
1 Temperature¹ 180 – 220 °C
1 Pressure 80 – 130 N/module
1 Time 1.5 s
Multiple step process (2 or more heating stamps) – Machine setting:
1 Temperature¹ 180 - 220 °C
1 Pressure 80 - 130 N/module
1 Time 2 x 0.7 s / 3 x 0.5 s
¹Temperature recommendations refer to what can be measured inside the heating stamp. Different temperature settings are recommended for different card material:
PVC 180 – 190 °C
ABS 180 – 190 °C
PET 190 – 200 °C
PC 200 – 220 °C
To reach maximum bonding strength surfaces should be clean and dry. Storage conditions according to tesa® HAF shelf life concept
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.
Downloads
Download the files below for more technical details and information on this product.
![[en-en] tesa_HAF-black_dr_001](/en-sg/files/images/202402/2/medium-11173881,11173881_padded1x1_18.webp "tesa_HAF-black_dr_001")
